Solder paste is a mixture of flux and powdered solder. The process of attaching electrical components to the contact pads is called reflow soldering. During this process, the controlled heat within SMT reflow soldering oven melts the solder, to connect the joints permanently. Special models are designed to meet high thermal requirements and fine mesh belts for miniature parts.
This method is the most commonly used one when it comes to attaching surface mount components to a circuit board. The biggest advantage of using this method is that the assembly costs are reduced, and the controlled heat doesn't cause damages to electrical components. Typical oven consists of several zones, or stages.
In the preheat stage, the solvent in a mixture of flux and powdered solder starts to evaporate. In the next zone, the fluxes are only temporarily joined, but the highest temperature is reached in the third stage. This temperature will depend on the component which is most susceptible to thermal damage.
Cooling zone is important part of the process. In this stage, the board is gradually cooled, and the joints are solidified. A cooling rate depends on components sensitivity as well. Generally, the rate of four degrees of Celsius per second is the most commonly used. Cooling rates have a significant effect on solder joint grain structure.
There are different types of SMT soldering ovens, including medium to high volume models, the ones designed as bench top models, and also nitrogen based. Compared to standard devices designed for the same purpose, they provide lower energy consumption and take up less space. Compact and practical, they can find their usage in different processes.
Medium to high volume ovens mostly have at least four independent reflow zones, with at least three thermocouple inputs, to ensure the best performance and the best heat control. They are equipped with wide LCD screens, and stainless steel mesh conveyors. They can accept wide boards, and provide very good handling flexibility. Smaller models are very good for testing purposes.
On-board computer permits on-screen profiling, and the parameters are set automatically. Particular parameters can be saved to a memory, and reloaded when needed. When re-loaded, all parameters can be additionally adjusted, including upper and lower limits, specific zones temperature settings and conveyor speeds.
Easy adjustable thermal management and other advanced functions make these devices easy to handle and safe to use. The system includes different alarms, and can be programmed to start up and shut down automatically. The combination of high efficiency, compact size and energy savings makes these models very convenient for all types of industries and for numerous other purposes.
Larger SMT ovens provide up to ten controlled upper and lower full-convection heating zones. They provide maximum functionality, automatic hood-life mechanism and high precision conveyor mechanism. This is a reliable solution for all medium and high volume manufacturers. It combines high mass heat sources with efficient thermal heat transfer, ensuring very good process stability.
Different types of SMT reflow soldering oven with pin over mesh conveyor system meet any production requirement. Pin conveyors permit inline and double-sided processing. All components are built of high quality stainless steel, to maintain dimensional tolerances at the high temperature lead-free processing. All systems are equipped with special battery backup.
This method is the most commonly used one when it comes to attaching surface mount components to a circuit board. The biggest advantage of using this method is that the assembly costs are reduced, and the controlled heat doesn't cause damages to electrical components. Typical oven consists of several zones, or stages.
In the preheat stage, the solvent in a mixture of flux and powdered solder starts to evaporate. In the next zone, the fluxes are only temporarily joined, but the highest temperature is reached in the third stage. This temperature will depend on the component which is most susceptible to thermal damage.
Cooling zone is important part of the process. In this stage, the board is gradually cooled, and the joints are solidified. A cooling rate depends on components sensitivity as well. Generally, the rate of four degrees of Celsius per second is the most commonly used. Cooling rates have a significant effect on solder joint grain structure.
There are different types of SMT soldering ovens, including medium to high volume models, the ones designed as bench top models, and also nitrogen based. Compared to standard devices designed for the same purpose, they provide lower energy consumption and take up less space. Compact and practical, they can find their usage in different processes.
Medium to high volume ovens mostly have at least four independent reflow zones, with at least three thermocouple inputs, to ensure the best performance and the best heat control. They are equipped with wide LCD screens, and stainless steel mesh conveyors. They can accept wide boards, and provide very good handling flexibility. Smaller models are very good for testing purposes.
On-board computer permits on-screen profiling, and the parameters are set automatically. Particular parameters can be saved to a memory, and reloaded when needed. When re-loaded, all parameters can be additionally adjusted, including upper and lower limits, specific zones temperature settings and conveyor speeds.
Easy adjustable thermal management and other advanced functions make these devices easy to handle and safe to use. The system includes different alarms, and can be programmed to start up and shut down automatically. The combination of high efficiency, compact size and energy savings makes these models very convenient for all types of industries and for numerous other purposes.
Larger SMT ovens provide up to ten controlled upper and lower full-convection heating zones. They provide maximum functionality, automatic hood-life mechanism and high precision conveyor mechanism. This is a reliable solution for all medium and high volume manufacturers. It combines high mass heat sources with efficient thermal heat transfer, ensuring very good process stability.
Different types of SMT reflow soldering oven with pin over mesh conveyor system meet any production requirement. Pin conveyors permit inline and double-sided processing. All components are built of high quality stainless steel, to maintain dimensional tolerances at the high temperature lead-free processing. All systems are equipped with special battery backup.
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