Surface Mount Technology (SMT) is a technology of soldering electrical components onto the pre-printed circuit boards. In order to make the whole process possible, SMT reflow soldering oven is usually used. This is a machine that employs high level of technology and bonding principles in its functionality. It is very complex but offers reliability and better alternative in the field of electrical assembly. This comes with advantages such as reduced board cost, controlled manufacturing and assembling process and reduced material handling.
This is one of the machines that get used more often than any other machines in the electrical line of assembly. Before passing over to the oven, the solder paste made of flux, small solder particles and chemical cleaning agents is used to loosely attach the electrical components on to the printed circuit board (PCB) and then sent to the next step.
It all starts by making of solder paste. This is a mixture of small solder particles, flux and some solvent that also work as a cleaning agent. This forms a sticky substance that is used to loosely attach electrical components on to specific points on the circuit board.
Through a conveyor belt, the PCB and the mounted components are directed into the oven. This requires time and temperature precision to avoid destroying any of the components. There are four phases that these components pass through in the oven. In starts at preheat zone where time/temperature rate (ramp rate) is determined. This is important to the other zones too as it gives the correct temperature to be used. The melting point of solvent is also set here.
This is followed by thermal soak zone where the PCB and its components are exposed to heating at specific temperature for between 60 to 120 seconds to remove paste volatiles. The third stage is reflow zone. At this stage, PCB gets exposed to the maximum possible temperature that is tolerable by all the electronics on it. This is usually set below the liquidus temperature-the temperature above which the electronics get destroyed. At this point, the surface tension at the joints and the joints is reduced, melting the solder and as such bonding the pads and electronics.
In the fourth and final zone, the process of cooling takes place. This too is a controlled process. The heating and cooling is such controlled that the PCB and components are not exposed to thermal shock. This is perhaps what makes SMT reflow soldering oven outperform all other methods of bonding.
Most of these ovens use ceramic heaters as the source of heat. The heat flows to the assemblies through hot air using fan (radiation) or just the infrared electromagnetic radiation. As the new models are introduces, the techniques of heat transfers are improved.
They are simpler to operate and work much faster with high accuracy level. They also have higher production level with ability to produce more that 136,000 components in a single hour. Attachment of the components can also be done on both sides at the same time with better electrical efficiency.
Electronic assembly just like any other industry is highly competitive. In order to remain a relevant market player, a firm must acquire the latest technology and most efficient production methods. The use of SMT reflow soldering oven is no longer optional in electrical assembly. In addition to higher level of production, efficiency and lower power consumption, the machine guarantees firms future survival and profitability.
This is one of the machines that get used more often than any other machines in the electrical line of assembly. Before passing over to the oven, the solder paste made of flux, small solder particles and chemical cleaning agents is used to loosely attach the electrical components on to the printed circuit board (PCB) and then sent to the next step.
It all starts by making of solder paste. This is a mixture of small solder particles, flux and some solvent that also work as a cleaning agent. This forms a sticky substance that is used to loosely attach electrical components on to specific points on the circuit board.
Through a conveyor belt, the PCB and the mounted components are directed into the oven. This requires time and temperature precision to avoid destroying any of the components. There are four phases that these components pass through in the oven. In starts at preheat zone where time/temperature rate (ramp rate) is determined. This is important to the other zones too as it gives the correct temperature to be used. The melting point of solvent is also set here.
This is followed by thermal soak zone where the PCB and its components are exposed to heating at specific temperature for between 60 to 120 seconds to remove paste volatiles. The third stage is reflow zone. At this stage, PCB gets exposed to the maximum possible temperature that is tolerable by all the electronics on it. This is usually set below the liquidus temperature-the temperature above which the electronics get destroyed. At this point, the surface tension at the joints and the joints is reduced, melting the solder and as such bonding the pads and electronics.
In the fourth and final zone, the process of cooling takes place. This too is a controlled process. The heating and cooling is such controlled that the PCB and components are not exposed to thermal shock. This is perhaps what makes SMT reflow soldering oven outperform all other methods of bonding.
Most of these ovens use ceramic heaters as the source of heat. The heat flows to the assemblies through hot air using fan (radiation) or just the infrared electromagnetic radiation. As the new models are introduces, the techniques of heat transfers are improved.
They are simpler to operate and work much faster with high accuracy level. They also have higher production level with ability to produce more that 136,000 components in a single hour. Attachment of the components can also be done on both sides at the same time with better electrical efficiency.
Electronic assembly just like any other industry is highly competitive. In order to remain a relevant market player, a firm must acquire the latest technology and most efficient production methods. The use of SMT reflow soldering oven is no longer optional in electrical assembly. In addition to higher level of production, efficiency and lower power consumption, the machine guarantees firms future survival and profitability.
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